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TR-9 PCB, 4-layer
#1
Hello everyone,<br><br>this thread shall serve as a way to organize design decisions and improvements for the upcoming 4-layer version of the TR-9 PCB.<br><br>I suggest FR-4 substrate with overall thickness of 1.2 mm. We should design components for automated assembly.<br>Maybe already for a specific manufacturer(JLCPCB?).<br><br>The stack-up would be as follows:<br>-. 35 um Top<br>-> 300 um Dielectric<br>-. 35 um GND<br>-> 550 um Dielectric<br>-. 35 um VCC<br>-> 300 um Dielectric<br>-. 35 um Bottom<br><br>So nothing too wild. Let me know what you think.<br>We also could take copper off Top/bottom and/or add width to the core for a more common(cheaper?) 1.6 mm overall thickness.<br><br>- pthrr<br>
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#2
As was suggested, maybe we can use the additional space and add a bluetooth module, e.g. BLUENRG-132 as available from JLCPCB<br><br>- pthrr
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#3
Sounds good to me Smile
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